
Snapdragon 875 details leaked: codenamed Lahaina

As normal, Qualcomm‘s next-generation flagship platform Snapdragon 875 will probably be unveiled within the fourth quarter of this 12 months however we’ll have o wait till Q1 2021 to seek out it inside a commercially obtainable smartphone. Particulars have now emerged in regards to the next-gen cell platform. Tipster Roland Quandt has revealed that the Snapdragon 875 (SM8350)adopts the inner codename Lahaina. The identify is initially that of a metropolis in Maui, one of many seven Hawaiian Islands.
A earlier leak suggestions the next-generation Qualcomm chipset to undertake the identify Snapdragon 875G as a substitute of Snapdragon 875. Nonetheless, Qualcomm is but to substantiate the identify but so we’ll keep on with SD875.
Fairly positive Qualcomm Snapdragon 875 (SM8350) is named “Lahaina” internally. Named after a metropolis on the island of Maui, Hawaii.
— Roland Quandt (@rquandt) July 24, 2020
The flagship processor will probably be constructed on the 5nm course of. Qualcomm will reportedly introduce a super-large core architectural mixture, which is Cortex X1+Cortex A78. ARM particulars the Cortex X1 core structure to supply a most efficiency that’s 30% greater than that of Cortex-A77 and 23% greater than the utmost efficiency of the Cortex-A78 core launched on the identical time. The machine studying functionality is alleged to be twice that of Cortex-A78.
Moreover, Qualcomm will now not utilise an exterior baseband design on the Snapdragon 875G however the baseband chip will probably be built-in with the processor with enchancment within the efficiency.
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